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BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti - 1
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BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti

Ürün Kodu : T1003
765,00 USD + KDV
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BGA-Bottom-327
(Ord. no. 70-3110)


  • 70-3110


  • bottom board of BGA adapters, assigned for eMMC devices (e.g. THGBMBG7D2KBAIL, KLM4G1FEAC-B031000) in matrix 14x14-8x8, 6x6-4x4
  • supported from PG4UW software version 3.07z09
  • made in Slovakia
Ord. no.70-3110
Connection to BGA-Top-X4x25 sockets for wire wrap pin
Bottom2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
ClassBGA/LGA
SubclassBGA-Bottom
Availability in stock34 pcs. [other 75 pcs. within 3 days]
Adapter manual
  • Protect the contacts of adapter connectors from contamination. Any dirt and/or fat on contacts may cause errors during programming.

  • For work with BGA device it is necessary put together BGA-Bottom-X with some BGA-Top-X board according to the information provided by PG4UW software.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

 



BGA-Top-284 ZIF (a)
(Ord. no. 70-2635A)


  • 70-2635A



  • special adapter, assigned for eMMC devices in BGA package
  • designed for TurboMode
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no.70-2635A
SocketZIF BGA153, OpenTop type
Connection to BGA-Bottom-X4x25 pins, square, 0.6x0.6mm
ClassBGA/LGA
SubclassBGA-Top
Availability in stock15 pcs. [other 40 pcs. within 3 days]
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-284 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

See this brochure for details on proper package loading procedure

Ürün Filtreleri
Tedarikçi Ürün Kodu :1003
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