Elnec

BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti

Elnec
Fiyat
:
765,00 USD + KDV
KDV Dahil
:
902,70 USD
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  • BGA-Bottom-327
    (Ord. no. 70-3110)


    • 70-3110


    • bottom board of BGA adapters, assigned for eMMC devices (e.g. THGBMBG7D2KBAIL, KLM4G1FEAC-B031000) in matrix 14x14-8x8, 6x6-4x4
    • supported from PG4UW software version 3.07z09
    • made in Slovakia
    Ord. no.70-3110
    Connection to BGA-Top-X4x25 sockets for wire wrap pin
    Bottom2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
    ClassBGA/LGA
    SubclassBGA-Bottom
    Availability in stock34 pcs. [other 75 pcs. within 3 days]
    Adapter manual
    • Protect the contacts of adapter connectors from contamination. Any dirt and/or fat on contacts may cause errors during programming.

    • For work with BGA device it is necessary put together BGA-Bottom-X with some BGA-Top-X board according to the information provided by PG4UW software.

    • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

     



    BGA-Top-284 ZIF (a)
    (Ord. no. 70-2635A)


    • 70-2635A



    • special adapter, assigned for eMMC devices in BGA package
    • designed for TurboMode
    • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
    • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
    • operating (mechanical) warranty of ZIF socket - 10,000 actuations
    • made in Slovakia
    Ord. no.70-2635A
    SocketZIF BGA153, OpenTop type
    Connection to BGA-Bottom-X4x25 pins, square, 0.6x0.6mm
    ClassBGA/LGA
    SubclassBGA-Top
    Availability in stock15 pcs. [other 40 pcs. within 3 days]
    Adapter manual
    • For work with BGA device it is necessary put together BGA-Top-284 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
    • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
    • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
    • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
    • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

    See this brochure for details on proper package loading procedure

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